STM32F103RCT7 Datasheet, PDF (112/130 Pages) STMicroelectronics – High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces

Package characteristics
Figure 62. BGA pad footprint
STM32F103xC, STM32F103xD, STM32F103xE
$PAD
$SM
-36
Table 65. Recommended PCB design rules (0.80/0.75 mm pitch BGA)
Dimension
Recommended values
Dpad
∅ = 0.37 mm
Dsm
∅ = 0.52 mm typ. (depends on solder mask registration tolerance)
Solder paste
0.37 mm aperture diameter
– Non solder mask defined pads are recommended
– 4 to 6 mils screen print
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Doc ID 14611 Rev 8