STM32F078CB Datasheet, PDF (111/120 Pages) STMicroelectronics – CRC calculation unit

STM32F078CB, STM32F078RB, STM32F078VB
Package information
7.6
UFQFPN48 package information
UFQFPN48 is a 48-lead, 7x7 mm, 0.5 mm pitch, ultra-thin fine-pitch quad flat package.
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Figure 48. UFQFPN48 package outline
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1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and
solder this back-side pad to PCB ground.
DocID026006 Rev 4
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