VD5377 Datasheet, PDF (11/88 Pages) STMicroelectronics – Ultra-low power motion sensor for optical finger navigation

VD5377
Silicon specification
2.4
Device pinout
Figure 2 shows the bond pad layout and Table 6 provides the bond pad coordinates. All
dimensions are in microns.
Figure 2. VD5377 bond pad layout
DVSS 1
I2C_SEL0 2
I2C_SEL1 3
I2C_SEL2 4
LED_OUT 5
DVSS 6
DVDD 7
BACKLED0 8
BACKLED1 9
BACKLED2 10
(0,19)
(0,0) 1st pixel
608 µm
Imaging Array
Array Centre
(-83, +447)
(19,19)
(19,0)
608 µm
Die Centre(0,0)
26 AVDD
25 AVSS
24 SCL
23 SDA
22 TEST_CLK
21 DVSS
20 MOTION
19 GPIO0
11 12 13 14 15 16 17 18
First pixel indicates start of
readout for image streaming.
NOT TO SCALE
Doc ID 022952 Rev 2
11/88