STM32F103VFT6 Datasheet, PDF (11/120 Pages) STMicroelectronics – XL-density performance line ARM-based 32-bit MCU

STM32F103xF, STM32F103xG
Description
2.1
Device overview
The STM32F103xx XL-density performance line family offers devices in four different
package types: from 64 pins to 144 pins. Depending on the device chosen, different sets of
peripherals are included, the description below gives an overview of the complete range of
peripherals proposed in this family.
Figure 1 shows the general block diagram of the device family.
Table 2. STM32F103xF and STM32F103xG features and peripheral counts
Peripherals
STM32F103Rx
STM32F103Vx
STM32F103Zx
Flash memory
SRAM in Kbytes
FSMC
General-purpose
Timers Advanced-control
Basic
SPI(I²S)⁽²⁾
I²C
USART
Comm
USB
CAN
SDIO
GPIOs
12-bit ADC
Number of channels
12-bit DAC
Number of channels
CPU frequency
Operating voltage
Operating temperatures
Package
768 KB
1 MB
768 KB
1 MB
768 KB
1 MB
96
96
96
No
Yes⁽¹⁾
Yes
10
2
2
3(2)
2
5
1
1
1
51
80
112
3
3
3
16
16
21
2
2
72 MHz
2.0 to 3.6 V
Ambient temperatures: –40 to +85 °C /–40 to +105 °C (see Table 10)
Junction temperature: –40 to + 125 °C (see Table 10)
LQFP64
LQFP100
LQFP144, BGA144
1. For the LQFP100 package, only FSMC Bank1 and Bank2 are available. Bank1 can only support a
multiplexed NOR/PSRAM memory using the NE1 Chip Select. Bank2 can only support a 16- or 8-bit NAND
Flash memory using the NCE2 Chip Select. The interrupt line cannot be used since Port G is not available
in this package.
2. The SPI2 and SPI3 interfaces give the flexibility to work in an exclusive way in either the SPI mode or the
I²S audio mode.
Doc ID 16554 Rev 3
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