RHFL4913XX25_10 Datasheet, PDF (11/19 Pages) STMicroelectronics – Rad-hard positive fixed voltage regulator

RHFL4913XX25, RHFL4913XX33, RHFL4913XX50
7
Notes about Flat-16 package
Notes about Flat-16 package
The bottom of package is metallized to allow user to directly solder the voltage regulator to
PCB, no heat sink needed, in order to optimize heat removal performance.
7.1
Radiation performances
The RHFL4913F has been tested against: 300krad TID ELDERS in accordance with Mil-
1019.6, bipolar section: post radiation parameters are within datasheet pre-rad limits.
Submitted to 200MeV Iodine ions of 60.4MeV/cm2/mg LET up to 1exp(+7) ions / cm2, no
SEL event has been detected.
7.2
Die information
RHFL4913 fixed is also available in die form. Space dice are electrically tested by
STMicroelectronics in such a way that, when mounted in proper thermal and electrical
substrate, they provide full compliance with equivalent packaged product.
- Max die dimensions: 2.794 mm by 3.861 mm or 110 mils by 152 mils
- Die thickness: 357 µm +/- 50 µm
- Pad size: 184 µm by 184 µm
- Metallization: Aluminum 4% silicon alloy
- Die backside: Bare silicon
- Die backside potential: Ground
Figure 5. Die size
(*) Die SENSE pad is active in RHFL4913 fixed die. It shall not be left unbonded. It should be bonded to V_O pin.
(**) Die adjust pad is available in the die lay-out but is not electrically connected to the IC. It shall be left
unconnected during hybrid bonding.
Doc ID 10004 Rev 11
11/19