STM8S103K3 Datasheet, PDF (100/113 Pages) STMicroelectronics – Access line, 16 MHz STM8S 8-bit MCU, up to 8 Kbytes Flash, data

Thermal characteristics
STM8S103K3 STM8S103F3 STM8S103F2
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Thermal characteristics
The maximum chip junction temperature (T_{J max}) must never exceed the values given in
Operating conditions.
The maximum chip-junction temperature, T_Jmax, in degrees Celsius, may be calculated using
the following equation:
T_Jmax = T_Amax + (P_Dmax x Θ_JA)
Where:
• ^TAmax ^{is the maximum ambient temperature in °C}
• ^ΘJA ^{is the package junction-to-ambient thermal resistance in °C/W}
• ^PDmax ^{is the sum of P}INTmax ^{and P}I/Omax ^{(PDmax = P}INTmax ^{+ P}I/Omax⁾
• ^PINTmax ^{is the product of I}DD ^andVDD^{, expressed in Watts. This is the maximum chip internal}
power.
• ^PI/Omax ^{represents the maximum power dissipation on output pins}
Where: P_I/Omax =Σ (V_OL*I_OL) + Σ((V_DD-V_OH)*I_OH), taking into account the actual V_OL/I_{OL and}
V_OH/I_OH of the I/Os at low and high level in the application.
Table 57: Thermal characteristics
Symbol
Parameter⁽¹⁾
Value
Unit
Θ_JA
Thermal resistance junction-ambient
84
TSSOP20 - 4.4 mm
°C/W
Θ_JA
Thermal resistance junction-ambient
91
SO20W (300 mils)
°C/W
Θ_JA
Thermal resistance junction-ambient
90
UFQFPN20 - 3 x 3 mm
°C/W
Θ_JA
Thermal resistance junction-ambient
60
LQFP32 - 7 x 7 mm
°C/W
Θ_JA
Thermal resistance junction-ambient
38
UFQFPN32 - 5 x 5 mm
°C/W
(1)_{Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural}
convection environment.
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