TSH93_07 Datasheet, PDF (10/13 Pages) STMicroelectronics – High-speed low power triple operational amplifier

Package information
RG1 19 5 3.160721E+03
RG2 19 4 3.160721E+03
CC 19 5 2.00000E-09
DOPM 19 22 MDTH 400E-12
DONM 21 19 MDTH 400E-12
HOPM 22 28 VOUT 1.504000E+03
VIPM 28 4 5.000000E+01
HONM 21 27 VOUT 1.400000E+03
VINM 5 27 5.000000E+01
***********************
RZP1 5 80 1E+06
RZP2 4 80 1E+06
GZP 5 82 19 80 2.5E-05
RZP2H 83 4 10000
RZP1H 83 82 80000
RZP2B 84 5 10000
RZP1B 82 84 80000
LZPH 4 83 3.535e-02
LZPB 84 5 3.535e-02
EOUT 26 23 82 5 1
VOUT 23 5 0
ROUT 26 3 35
COUT 3 5 30.000000E-12
DOP 19 25 MDTH 400E-12
VOP 4 25 2.361965E+00
DON 24 19 MDTH 400E-12
VON 24 5 2.361965E+00
.ENDS
TSH93
6
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK^®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
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