TDA7854 Datasheet, PDF (10/12 Pages) STMicroelectronics – 4 x 47W MOSFET quad bridge power amplifier

Package information
5
Package information
TDA7854
In order to meet environmental requirements, ST offers this device in ECOPACK^® packages.
This package has a Lead-free second level interconnect. The category of second level
interconnect is marked on the package and on the inner box label, in compliance with
JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also
marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 5. Flexiwatt25 mechanical data and package dimensions
DIM.
A
MIN.
4.45
mm
TYP.
4.50
MAX. MIN.
4.65 0.175
B 1.80 1.90 2.00 0.070
C
1.40
D 0.75 0.90 1.05 0.029
E 0.37 0.39 0.42 0.014
F (1)
0.57
G 0.80 1.00 1.20 0.031
G1 23.75 24.00 24.25 0.935
H (2) 28.90 29.23 29.30 1.139
H1
17.00
H2
12.80
H3
0.80
L (2) 22.07 22.47 22.87 0.869
L1 18.57 18.97 19.37 0.731
L2 (2) 15.50 15.70 15.90 0.610
L3 7.70 7.85 7.95 0.303
L4
5
L5
3.5
M 3.70 4.00 4.30 0.145
M1 3.60 4.00 4.40 0.142
N
2.20
O
2
R
1.70
R1
0.5
R2
0.3
R3
1.25
R4
0.50
V
5˚ (T p.)
V1
3˚ (Typ.)
V2
20˚ (Typ.)
V3
45˚ (Typ.)
(1): dam-bar protusion not included
(2): molding protusion included
inch
TYP.
0.177
0.074
0.055
0.035
0.015
0.040
0.945
1.150
0.669
0.503
0.031
0.884
0.747
0.618
0.309
0.197
0.138
0.157
0.157
0.086
0.079
0.067
0.02
0.12
0.049
0.019
MAX.
0.183
0.079
0.041
0.016
0.022
0.047
0.955
1.153
0.904
0.762
0.626
0.313
0.169
0.173
OUTLINE AND
MECHANICAL DATA
Flexiwatt25 (vertical)
V
B
V3
Pin 1
H3
G
C
V
H
H1
H2
A
R3
R4
V1
R2
N
R
L L1
V1
V2
G1
F
R2
R1
D
L5
FLEX25ME
R1 R1
E
M M1
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