STM8L151XX Datasheet, PDF (10/101 Pages) STMicroelectronics – 8-bit ultralow power MCU, up to 32 KB Flash, 1 KB Data EEPROM RTC, LCD, timers, USART, I2C, SPI, ADC, DAC, comparators

Description
STM8L151xx, STM8L152xx
2.1
Device overview
Table 2.
STM8L15x low power device features and peripheral counts
Features
STM8L151Gx
STM8L15xKx
STM8L15xCx
Flash (Kbytes)
Data EEPROM (Kbytes)
RAM-Kbytes
LCD
Basic
Timers
General purpose
Advanced control
SPI
Communication
interfaces
I2C
USART
GPIOs
12-bit synchronized ADC
(number of channels)
12-Bit DAC
(number of channels)
Comparators COMP1/COMP2
Others
CPU frequency
Operating voltage
Operating temperature
Packages
16
32
16
32
16
32
1
2
2
2
No
4x17 ⁽¹⁾
4x28 ⁽¹⁾
1
(8-bit)
1
(8-bit)
1
(8-bit)
2
(16-bit)
2
(16-bit)
2
(16-bit)
1
(16-bit)
1
(16-bit)
1
(16-bit)
1
1
1
1
1
1
1
26⁽³⁾
1
30 ⁽²⁾⁽³⁾ or 29 ⁽¹⁾⁽³⁾
1
41⁽³⁾
1
1
1
(18)
(22 ⁽²⁾ or 21 ⁽¹⁾)
(25)
1
1
1
(1)
(1)
(1)
2
2
2
RTC, window watchdog, independent watchdog,
16-MHz and 38-kHz internal RC, 1- to 16-MHz and 32-kHz external oscillator
16 MHz
1.8 V to 3.6 V (down to 1.65 V at power down)
-40 to +85 °C / -40 to +125 °C
WFQFPN28 ⁽⁴⁾(4x4;
0.8 mm thickness)
WFQFPN32 ⁽⁵⁾(5x5;
0.8 mm thickness)
LQFP32(7x7)
VFQFPN48 ⁽⁶⁾(4x4;
1 mm thickness)
LQFP48
1. STM8L152xx versions only
2. STM8L151xx versions only
3. The number of GPIOs given in this table includes the NRST/PA1 pin but the application can use the NRST/PA1 pin as
general purpose output only (PA1).
4. WFQFPN28 package used in the sampling phase. In the production phase, the UFQFPN28 package will be used with a
thickness equal to 0.6 mm.
5. WFQFPN32 package used in the sampling phase. In the production phase, the UFQFPN32 package will be used with a
thickness equal to 0.6 mm.
6. VFQFPN48 package used in the sampling phase. In the production phase, the UFQFPN48 package will be used with a
thickness equal to 0.6 mm.
10/101
Doc ID 15962 Rev 2