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| RHFL4913_07 Datasheet, PDF (10/16 Pages) STMicroelectronics – Rad-Hard Adjustable positive voltage regulator | |||
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DIE Information
RHFL4913 ADJUSTABLE VERSION
6.1 Die bonding pad locations and electrical functions.
Die physical dimensions.
Die size: 150mils x 110mils (3.81mm by 2.79mm)
Die thickness: 375µm ± 25µm (14.8 mils ± 1 mil)
Pad size: VIN, VOUT pads: 450µm x 330µm (17.7mils by 13mils)
Control pads: 184µm x 184µm (7.25mils square)
Interface materials.
Top metallization: Al/Si/Cu, 1.05µm ± 0.15µm
Backside metallization: None
Glassivation.
Type: P. Vapox + Nitride
Thickness: 0.6µm ± 0.1µm + 0.6µm ± 0.08µm
Substrate: bare Silicon
Assembly related information.
Substrate potential: Floating recommended to be tied to Ground
Special assembly instructions: "Sense" pad not used, not internally connected to any
part of the IC. Can be connected to Ground when space anti-static electricity rules
apply.
10/16
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