L9301 Datasheet, PDF (10/51 Pages) STMicroelectronics – Over temperature protection

Electrical specifications
L9301
3.3
Operating range
Symbol
VB
VDD
VDD_IO
Table 5. Operating range
Parameter
Min.
Max.
Unit
Supply voltage
VB_UV
18
V
Stabilized supply voltage
VDD_UV VDD_OV
V
Logic output supply voltage
3.0
5.5
V
3.4
Thermal data
Table 6. Thermal data
Symbol
Parameter
Min.
T_amb(1)
Operating ambient temperature
-40
T_stg
Storage temperature
-40
T_j
Junction temperature
-40
T_sd
Thermal shutdown temperature
180
T_sd-hys
Thermal shutdown temperature hysteresis
-
1. For information only, in any case T_j limits must not exceed.
Typ.
-
-
-
-
10
Max.
Unit
125
°C
150
°C
175
°C
195
°C
-
°C
Table 7. Thermal resistance
Symbol
Parameter
Working conditions
Value
Unit
R_{th j-amb}
Junction to ambient
2s2p (4L) board; Natural convection⁽¹⁾
27
2s2p (4L) board on ECU metal plate⁽²⁾
8
°C/W
°C/W
R_{th j-bottom case} Junction to bottom case
Bottom cold plate⁽³⁾
1
R_{th j-top case} Junction to top case
Top cold plate⁽⁴⁾
21
Psi_{j-top case} Psi Junction to top case 2s2p (4L) board; Natural convection ⁽¹⁾
2
°C/W
°C/W
°C/W
1. Jedec STD. JESD51.
2. Package assembled on 2s2p (4L) board. The board bottom side is in contact with a metal plate as per typical automotive
application (ECU system). See Figure 3.
3. Thermal resistance between the die and the bottom case surface in ideal contact and measured by cold plate as per Jedec
best practice guidelines (JESD51).
4. Thermal resistance between the die and the top case surface in ideal contact and measured by cold plate as per Jedec
best practice guidelines (JESD51).
Figure 3. Device assembled on 2s2p PCB with high density vias in contact with a metal plate
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