BALF-NRG-01D3 Datasheet, PDF (10/13 Pages) STMicroelectronics – Low amplitude imbalance

Package information
BALF-NRG-01D3
Dim.
A
A1
A2
b
D
D1
E
E1
SE
fD
fE
ccc
$
Table 4. Flip-Chip package mechanical data
mm
Min.
0.580
0.180
0.380
0.230
1.375
0.99
0.825
0.39
0.17
0.195
Typ.
0.630
0.205
0.40
0.255
1.40
1
0.85
0.4
0.2
0.2
0.225
0.025
Max.
0.680
0.230
0.420
0.280
1.425
1.01
0.875
0.41
0.23
0.255
0.05
Figure 23. Footprint - 3 mils stencil -non solder
mask defined
&RSSHUSDGGLDPHWHU
—PUHFRPPHQGHG
—PPLQLPXP
—PPD[LPXP
Figure 24. Footprint - 3 mils stencil - solder
mask defined
6ROGHUPDVNRSHQLQJ
—PUHFRPPHQGHG
—PPLQLPXP
—PPD[LPXP
6ROGHUPDVNRSHQLQJ
—PUHFRPPHQGHG
—PPLQLPXP
—PPD[LPXP
&RSSHUSDGGLDPHWHU
—PUHFRPPHQGHG
—PPLQLPXP
6ROGHUVWHQFLORSHQLQJ
—PUHFRPPHQGHG
6ROGHUVWHQFLORSHQLQJ
—PUHFRPPHQGHG
Figure 25. Footprint - 5 mils stencil -non solder
mask defined
&RSSHUSDGGLDPHWHU
—PUHFRPPHQGHG
—PPLQLPXP
—PPD[LPXP
Figure 26. Footprint - 5 mils stencil - solder
mask defined
6ROGHUPDVNRSHQLQJ
—PUHFRPPHQGHG
—PPLQLPXP
—PPD[LPXP
6ROGHUPDVNRSHQLQJ
—PUHFRPPHQGHG
—PPLQLPXP
—PPD[LPXP
&RSSHUSDGGLDPHWHU
—PUHFRPPHQGHG
—PPLQLPXP
6ROGHUVWHQFLORSHQLQJ
—PUHFRPPHQGHG
GHSHQGLQJRQSDVWHLWFDQJRGRZQWR—P
10/13
6ROGHUVWHQFLORSHQLQJ
—PUHFRPPHQGHG
GHSHQGLQJRQSDVWHLWFDQJRGRZQWR—P
DocID026543 Rev 4