USBULC6-2F7 Datasheet, PDF (1/9 Pages) STMicroelectronics – 2-line Transil ultralow capacitance protection for high speed USB

USBULC6-2F7
2-line Transil™ ultralow capacitance protection for high speed USB
Flip Chip
(4 bumps)
Features
 Ultralow capacitance (1pF)
 Two data lines (D+ and D-) protected against
ESD
 Breakdown voltage V_BR = 5.5 V min.
 Flip Chip 350 µm pitch, lead-free
 Very low leakage current
 Very small PCB area
 RoHS compliant
Benefits
 Minimized impact on rise and fall times for
maximum data integrity
 Low PCB space occupation
 Higher reliability offered by monolithic
integration
Complies with the following standards
 IEC 61000-4-2 level 4:
– ±8 kV (contact discharge)
 MIL STD 883G - Method 3015.7
– ±25 kV (Human body model)
Application
This device is designed to protect a high speed
USB port in wireless handsets (up to 480 Mb/s
according to USB 2.0 high speed specification).
Datasheet  production data
Description
The USBULC6-2F7 is a monolithic, application
specific discrete device dedicated to ESD
protection of high speed interfaces.
Its ultra low line capacitance secures a high level
of signal integrity without compromising the
protection of downstream sensitive chips against
the most stringently characterized ESD strikes.
Figure 1. Pin layout (bump side)
AB
1
2
Figure 2. Device configuration
A1
B1
A2
B2
Note: B1 and B2 bumps must be grounded on
the PCB together
TM: Transil is a trademark of STMicroelectronics
December 2013
This is information on a product in full production.
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