TS4621ML Datasheet, PDF (1/40 Pages) STMicroelectronics – High-performance class-G stereo headphone amplifier

TS4621ML
High-performance class-G stereo headphone amplifier
Features
■ Power supply range: 2.3 V to 4.8 V
■ 0.6 mA/channel quiescent current
■ 2.1 mA current consumption with
100 µW/channel (10 dB crest factor)
■ 0.006% typical THD+N at 1 kHz
■ 100 dB typical PSRR at 217 Hz
■ 100 dB of SNR A-weighted at G = 0 dB
■ Zero "pop and click"
■ Gain settings : 0 dB and 6 dB
■ Integrated high efficiency step-down converter
■ Low standby current: 5 µA max
■ Output-coupling capacitors removed
■ Thermal shutdown
■ Flip-chip package: 1.65 mm x 1.65 mm,
400 µm pitch, 16 bumps
Applications
■ Cellular phones, smartphones
■ Mobile internet devices
■ PMP/MP3 players
■ Portable CD/DVD players
Description
The TS4621ML is a class-G stereo headphone
driver dedicated to high-performance audio, high-
power efficiency and space-constrained
applications.
It is based on the core technology of a low power
dissipation amplifier combined with a high-
efficiency step-down DC/DC converter for
supplying this amplifier.
When powered by a battery, the internal step-
down DC/DC converter generates the appropriate
voltage to the amplifier depending on the
Datasheet − production data
TS4621MLEIJT - flip-chip
Pinout (top view)
TOP VIEW
INR- VOUTR
GAIN
EN
D
INR+
CMS
PVSS
C2 C
INL+ HPVDD
C1
AGND B
INL-
VOUTL AVDD
4
3
2
SW A
1
Balls are underneath
amplitude of the audio signal to supply the
headsets. It achieves a total 2.1 mA current
consumption at 100 µW output power (10 dB
crest factor).
THD+N is 0.02 % maximum at 1 kHz and PSRR
is 100 dB at 217 Hz, which ensures a high audio
quality of the device in a wide range of
environments.
The traditionally bulky output coupling capacitors
can be removed.
A dedicated common-mode sense pin removes
parasitic ground noise.
The TS4621ML is designed to be used with an
output serial resistor. It ensures unconditional
stability over a wide range of capacitive loads.
The TS4621ML is packaged in a tiny 16-bump
flip-chip package with a pitch of 400 µm.
May 2012
This is information on a product in full production.
Doc ID 023181 Rev 1
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