TS4621E Datasheet, PDF (1/32 Pages) STMicroelectronics – High-performance class-G stereo headphone amplifier with I2C volume control

TS4621E
High-performance class-G stereo headphone amplifier
with I²C volume control
Features
■ Power supply range: 2.3 V to 4.8 V
■ 0.6 mA/channel quiescent current
■ 2.1 mA current consumption with
100 µW/channel (10 dB crest factor)
■ 0.006% typical THD+N at 1 kHz
■ 100 dB typical PSRR at 217 Hz
■ 100 dB of SNR A-weighted at G = 0 dB
■ Zero pop and click
■ I²C interface for volume control
■ Digital volume control range from -60 dB to
+4 dB
■ Independent right and left channel shutdown
control
■ Integrated high-efficiency buck converter
■ Low software standby current: 5 µA max
■ Output-coupling capacitors removed
■ Thermal shutdown and short-circuit protection
■ Flip-chip package: 1.65 mm x 1.65 mm,
400 µm pitch, 16 bumps
Applications
■ Cellular phones, smart phones
■ Mobile internet devices
■ PMP/MP3 players
Description
The TS4621E is a class-G stereo headphone
driver dedicated to high audio performance, high
power efficiency and space-constrained
applications.
It is based on the core technology of a low power
dissipation amplifier combined with a high-
efficiency buck converter for supplying this
amplifier.
TS4621EIJT - flip-chip
Pinout (top view)
INR-
VOUTR
SCL
SDA D
INR+
CMS
PVSS
C2
C
INL+
HPVDD
C1
AGND B
INL-
VOUTL
AVDD
4
3
2
SW _A
1
Balls are underneath
When powered by a battery, the buck converter
generates the appropriate voltage to the amplifier
depending on the amplitude of the audio signal to
supply the headsets. It achieves a total 2.1 mA
current consumption at 100 µW output power
(10 dB crest factor).
THD+N is 0.02% maximum at 1 kHz and PSRR is
100 dB at 217 Hz, which ensures a high audio
quality of the device in a wide range of
environments.
The traditionally bulky output coupling capacitors
can be removed.
A dedicated common-mode sense pin removes
parasitic ground noise.
The TS4621E is designed to be used with an
output serial resistor. It ensures unconditional
stability over a wide range of capacitive loads.
The TS4621E is packaged in a tiny 16-bump
flip-chip package with a pitch of 400 µm.
September 2011
Doc ID 022201 Rev 1
1/32
www.st.com
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