TN1204 Datasheet, PDF (1/15 Pages) STMicroelectronics – Tape and reel shipping media for STM32 microcontrollers in BGA packages

TN1204
Technical note
Tape and reel shipping media for STM32 microcontrollers in BGA
packages
Introduction
BGA packages can be supplied in tape and reel shipping media.
The reels have a 13” typical diameter. The types of reel used are in plastic either anti static
or conductive, with a black conductive cavity tape. The cover tape is transparent anti static
or conductive.
The devices are positioned in the cavities with the identifying pin (normally Pin “1”) on the
same side as the sprocket holes in the tape.
STMicroelectronics tape and reels are compliant with EIA 481 and IEC 60286-3 standard
specifications.
Table 1 lists the BGA packages available for STM32 microcontrollers, as well as the
corresponding shipping media.
Package
UFBGA 10x10
UFBGA 10x10
LFBGA 10x10
LFBGA 10x10
TFBGA 13x13
UFBGA 5x5
TFBGA 5x5
LFBGA 6x6
UFBGA 7x7
UFBGA 7x7
UFBGA 7x7
UFBGA 7x7
LFBGA 8x8
Table 1. BGA packages available in tape and reel packing
Description
Package Reel
code diameter
UFBGA 10X10 144 balls, 0.8 mm pitch
UFBGA 10X10X0.6 176+25 balls, 0.65 mm pitch
A02Y
A0E7
LFBGA 10x10x1.7 100 balls, F10x10, 0.8 mm pitch
H0
LFBGA 10x10x1.7, 144 balls, F12x12, 0.8 mm pitch
X3
TFBGA 13X13X1.2, 216 balls, 0.8 mm pitch
A0L2
UFBGA 5X5X0.6 64 balls, 0.5 mm pitch
A019
TFBGA 5x5x1.2 64 F8x8 0.5 mm pitch
R8
13”
LFBGA 6x6x1.7, 36 balls, 6F, 0.8 mm pitch
UFBGA 7x7x0.60, 144 balls, R12sq, 0.5 mm pitch
UFBGA 7x7x0.60, 100 balls, R12sq, 0.5 mm pitch
UFBGA 7X7X0.6, 132 balls, 0.5 mm pitch, R 12X12
AL
A0AS
A0C2
A0G8
UFBGA 7X7X0.6, 169 balls, 0.5 mm pitch
LFBGA 8x8x1.7, 64 balls, 8F, 0.8 mm pitch
A0YV
AH
Tape
width
24 mm
24 mm
24 mm
24 mm
24 mm
12 mm
12 mm
24 mm
16 mm
16 mm
16 mm
16 mm
16 mm
Tape
pitch
16 mm
16 mm
16 mm
16 mm
16 mm
8 mm
8 mm
16 mm
12 mm
12 mm
12 mm
12 mm
12 mm
February 2015
DocID027385 Rev 2
1/15
www.st.com
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