TN1200 Datasheet, PDF (1/16 Pages) STMicroelectronics – package description and recommendations for use

TN1200
Technical note
IPAD™, micro-bump Flip Chip:
package description and recommendations for use
Introduction
This document provides package and usage recommendation information for 200 µm (min.)
pitch Flip Chips. For information on 500 µm Flip Chips, see Application note AN1235. For
information on 400 µm Flip Chips, see Application note AN2348.
The competitive market of portable equipment, notably the mobile phone market, is driven
by a challenging development of highly integrated products. To allow manufacturers of
portable equipment to reduce the dimension of their products, STMicroelectronics has
developed packages with reduced size, thickness and weight in the form of the Flip Chip.
The electrical performance of such components in Flip Chips is improved thanks to shorter
connections than the ones in standard plastic packages (such as TSSOP, SSOP or BGA).
Figure 1. Micro-bumped flip-chip packages
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The Flip-Chip package family has been designed to fulfill the same quality levels and the
same reliability performances as standard semiconductor plastic packages. This means
these new Flip-Chip packages should be considered as new surface mount devices which
will be assembled on a printed circuit board (PCB) without any special or additional process
steps required. In particular this package does not require any extra underfill to increase
reliability performances or to protect the device. This package is compatible with existing
pick and place equipment for board mounting. Only lead-free, RoHS compliant Flip Chips
are available in mass production.
This application note addresses the following topics:
• Product description
• Mechanical description
• Packing specifications and labeling description
• Recommended storage and shipping instructions
• Soldering assembly recommendations
• User responsibility and returns
• Changes
• Delivery quantity
• Quality
December 2014
DocID027277 Rev 1
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www.st.com
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