TN0885 Datasheet, PDF (1/6 Pages) STMicroelectronics – STMicroelectronics has introduced a new package family

TN0885
Technical note
New I²PAKFP (TO-281) package, practical approach for compact
and slim product design needs
Introduction
STMicroelectronics has introduced a new package family, I²PAKFP, which is JEDEC
approved as TO-281. The package provides product system designers additional options to
meet compact and slim product design needs, such as those addressing the fast growing
ultrabook / notebook / netbook semi-slim adaptor market, as well as other potential
applications in AIO PC, compact lighting dimmer/ballast...etc. This fully molded I²PAKFP
(TO-281) package is 30% shorter in body height compared to the current TO-220FP
package and yet maintains the same level of thermal resistance, electrical isolation and
heatsink mounting possibilities as the current TO-220FP package.
Figure 1. I²PAKFP (TO-281) vs. TO-220FP size comparison
Approx.
30%
shorter
Step
cutting
for better
creepage
I2PAKFP
(TO-281)
TO-220FP
I2PAKFP
(TO-281)
Figure 2. I²PAKFP (TO-281) package (top and bottom)
TO-220FP
AM12603V1
March 2012
Doc ID 022904 Rev 1
AM12604V1
1/6
www.st.com