TN0108 Datasheet, PDF (1/26 Pages) STMicroelectronics – Migration differences between SPC560B4x/50

TN0108
Technical note
Migration differences between SPC560B4x/50 and
SPC560C4x/50 512KB Cut 1 to Cut 2
Introduction
STMicroelectronics have created an e200Z0 core-based Power Architecture family of
devices targeted at automotive body applications.
This document details the changes that have been implemented going between Cut 1.1 and
Cut 2 of the device.
Reading this document will expedite migration time for customers, who are currently using
Cut 1.1 silicon and will require to migrate to the Cut 2 device.
This document is not intended to replace the reference manual or device errata list and
differences pointed out in this document should be cross referenced with the relevant
sections in the latest reference manual and errata document.
The Table 1 shows the full part numbers and device identification.
Table 1. Device identification
Device
manufacturer
Part numbers
Maskset
Cut 1.1
Cut 2
JTAG ID
Cut 1.1
Cut 2
Package device
marking mask
identifier
Cut 1.1 Cut 2
SPC560B40L3,
SPC560B40L5,
SPC560B44L3,
SPC560B44L5,
STMicroelectronics
SPC560B50B2,
SPC560B50L3,
FB50X11Z
FB50X20B
0x1AE40041
0x0AE41041
Z
B
SPC560B50L5,
SPC560C40L3,
SPC560C44L3,
SPC560C50L3
For simplicity throughout this document, the MCU will be referred to as the SPC560B. For
differences between the B and C variants, please consult the reference manual.
September 2013
Doc ID 15874 Rev 2
1/26
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