STWLC03 Datasheet, PDF (1/5 Pages) STMicroelectronics – Dual mode Qi/PMA wireless power receiver

STWLC03
Dual mode Qi/PMA wireless power receiver
Data brief
Features
 Up to 7.5 W output power
 Qi and/or PMA standard communication
protocol
 Integrated high efficiency synchronous
rectifier
 1 MHz programmable buck converter with
input current and input voltage regulation
loop
 Buck converter efficiency up to 92%
 Simplified Li-Ion/Polymer charger function
 32-bit, 16 MHz embedded microcontroller
with 16 Kbyte ROM and 2 Kbyte RAM
memory
 2 Kbyte NVM memory for customization
 10-bit, 8 channel A/D converter
 Integrated driver for external supply voltage
switch
 Four configurable GPIOs
 Integrated 5 V LDO for auxiliary features
 Precise voltage and current measurements
for FOD function
 Transmitter presence detection
 Integrated driver for external resonant switch
 I²C interface
 Rx coil NTC protection
 Thermal protection
 Flip Chip 77 bumps (3.12x4.73 mm)
Applications
 Cellular phones
 PDAs
 Navigation systems
 Medical and healthcare instrumentation
Description
The STWLC03 is a high-end WPC and PMA
compliant wireless power receiver IC. It includes
a wireless power receiver, a programmable buck
converter with simplified basic Li-Polymer/Li-Ion
battery charger function and the embedded
microcontroller, which allows a very wide range of
customization and different standard supports.
The integrated NVM memory stores the
customized parameters via JTAG or I²C interface
of the device. Thanks to the integrated
synchronous rectifier, it achieves high efficiency
operations. The buck converter contains the
configurable soft-start, input current and input
voltage regulation loops to optimize the function
in a wireless charging enviroment. If the wireless
power is not available, the device can be
supplied from an external supply and can
connect this supply (5 V adapter/USB) to V_OUT
through an external switch. The embedded
microcontroller communicates with the host
platform through the I²C. The device contains
blocks for the frequency detection and the driver
for the external switch for the resonant frequency
change. The package is a CSP suitable for very
compact applications and it has a quad SPI
interface with the external Flash memory for
firmware development purposes.
Table 1: Device summary
Order code
Package
Packing
STWLC03JR
Flip Chip 77
bumps
(3.12x4.73 mm)
Tape and reel
June 2015
DocID027918 Rev 2
For further information contact your local STMicroelectronics sales
office
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