English
Language : 

STW9NC80Z Datasheet, PDF (1/8 Pages) STMicroelectronics – N-CHANNEL 800V - 0.82ohm - 9.4A TO-247 Zener-Protected PowerMESH™III MOSFET
STW9NC80Z
N-CHANNEL 800V - 0.82Ω - 9.4A TO-247
Zener-Protected PowerMESH™III MOSFET
TYPE
VDSS
RDS(on)
ID
STW9NC80Z
800 V
<0.9Ω
9.4 A
n TYPICAL RDS(on) = 0.82Ω
n EXTREMELY HIGH dv/dt CAPABILITY
n GATE-TO-SOURCE ZENER DIODES
n 100% AVALANCHE TESTED
n VERY LOW INTRINSIC CAPACITANCES
n GATE CHARGE MINIMIZED
DESCRIPTION
The third generation of MESH OVERLAY™ Power
MOSFETs for very high voltage exhibits unsur-
passed on-resistance per unit area while integrating
back-to-back Zener diodes between gate and
source. Such arrangement gives extra ESD capabil-
ity with higher ruggedness performance as request-
ed by a large variety of single-switch applications.
TO-247
APPLICATIONS
n SINGLE-ENDED SMPS IN MONITORS,
COMPUTER AND INDUSTRIAL APPLICATION
n WELDING EQUIPMENT
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VDS
Drain-source Voltage (VGS = 0)
800
V
VDGR
Drain-gate Voltage (RGS = 20 kΩ)
800
V
VGS
Gate- source Voltage
±25
V
ID
Drain Current (continuous) at TC = 25°C
9.4
A
ID
Drain Current (continuous) at TC = 100°C
5.9
A
IDM (1)
Drain Current (pulsed)
38
A
PTOT
Total Dissipation at TC = 25°C
190
W
Derating Factor
1.52
W/°C
IGS
Gate-source Current
±50
mA
VESD(G-S) Gate source ESD(HBM-C=100pF, R=15KΩ)
4
KV
dv/dt(q)
Peak Diode Recovery voltage slope
3
V/ns
VISO
Insulation Winthstand Voltage (DC)
--
V
Tstg
Storage Temperature
–65 to 150
°C
Tj
Max. Operating Junction Temperature
(•)Pulse width limited by safe operating area
150
°C
(1)ISD ≤9.4A, di/dt ≤100A/µs, VDD ≤ V(BR)DSS, Tj ≤ TJMAX
September 2002
1/8