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STU7NB90 Datasheet, PDF (1/9 Pages) STMicroelectronics – N-CHANNEL 900V - 1.1 ohm - 7.3 A Max220/Max220I PowerMesh™ MOSFET
STU7NB90
STU7NB90I
N-CHANNEL 900V - 1.1 Ω - 7.3 A Max220/Max220I
PowerMesh™ MOSFET
TYPE
VDSS
RDS(on)
ID
STU7NB90
900 V < 1.45 Ω 7.3 A
STU7NB90I
900 V < 1.45 Ω 7.3 A
s TYPICAL RDS(on) = 1.1 Ω
s EXTREMELY HIGH dv/dt CAPABILITY
s 100% AVALANCHE TESTED
s VERY LOW INTRINSIC CAPACITANCES
s GATE CHARGE MINIMIZED
s REDUCED VOLTAGE SPREAD
DESCRIPTION
Using the latest high voltage MESH OVERLAY™
process, STMicroelectronics has designed an ad-
vanced family of power MOSFETs with outstanding
performances. The new patent pending strip layout
coupled with the Company’s proprieraty edge termi-
nation structure, gives the lowest RDS(on) per area,
exceptional avalanche and dv/dt capabilities and
unrivalled gate charge and switching characteris-
tics.
23
1
Max220
Max220I
INTERNAL SCHEMATIC DIAGRAM
APPLICATIONS
s HIGH CURRENT, HIGH SPEED SWITCHING
s SWITH MODE POWER SUPPLIES (SMPS)
s DC-AC CONVERTERS FOR WELDING
EQUIPMENT
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
VDS
Drain-source Voltage (VGS = 0)
VDGR
Drain-gate Voltage (RGS = 20 kΩ)
VGS
Gate- source Voltage
ID
Drain Current (continuos) at TC = 25°C
ID
Drain Current (continuos) at TC = 100°C
IDM (q) Drain Current (pulsed)
PTOT
Total Dissipation at TC = 25°C
Derating Factor
dv/dt (1) Peak Diode Recovery voltage slope
VISO
Insulation Withstand Voltage (DC)
Tstg
Storage Temperature
Tj
Max. Operating Junction Temperature
(•)Pulse width limited by safe operating area
May 2001
Value
Unit
STU7NB90
STU7NB90I
900
V
900
V
±30
V
7.3
7.3 (*)
A
4.6
4.6 (*)
A
29.2
29.2 (*)
A
170
60
W
1.36
0.47
W/°C
4
V/ns
-
2500
V
–65 to 150
°C
150
°C
(1) ISD ≤7.3 A, di/dt ≤200A/µs, VDD ≤ V(BR)DSS, Tj ≤ TJMAX.
(*) Current Limited by Package
1/9