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STP60NS04Z Datasheet, PDF (1/8 Pages) STMicroelectronics – N - CHANNEL CLAMPED 10mohm - 60A - TO-220 FULLY PROTECTED MESH OVERLAY MOSFET
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STP60NS04Z
N - CHANNEL CLAMPED 10mΩ - 60A - TO-220
FULLY PROTECTED MESH OVERLAY™ MOSFET
TYPE
V DSS
RDS(on)
ID
STP60NS04Z
CLAMPED <0.015 Ω 60 A
s TYPICAL RDS(on) = 0.010 Ω
s 100% AVALANCHE TESTED
s LOW CAPACITANCE AND GATE CHARGE
s 175 oC MAXIMUM JUNCTION
TEMPERATURE
PRELIMINARY DATA
DESCRIPTION
This fully clamped Mosfet is produced by using
the latest advanced Company’s Mesh Overlay
process which is based on a novel strip layout.
The inherent benefits of the new technology
coupled with the extra clamping capabilities make
this product particularly suitable for the harshest
operation conditions such as those encountered
in the automotive environment. Any other
application requiring extra ruggedness is also
recommended.
3
2
1
TO-220
INTERNAL SCHEMATIC DIAGRAM
APPLICATIONS
s ABS, SOLENOID DRIVERS
s MOTOR CONTROL
s DC-DC CONVERTERS
ABSOLUTE MAXIMUM RATINGS
Sy mb o l
P a ramet er
Va l u e
Un it
V DS
VDG
VGS
ID
ID
IDG
IGS
IDM (•)
Ptot
Drain-source Voltage (VGS = 0)
Drain- gate Voltage
Gate-source Voltage
Drain Current (continuous) at Tc = 25 oC
Drain Current (continuous) at Tc = 100 oC
Drain Gate Current (continuous)
G ate Source Current (continuous)
Drain Current (pulsed)
T otal Dissipation at Tc = 25 oC
Derating Factor
C LA M P E D
C LA M P E D
C LA M P E D
60
42
± 50
± 50
240
140
0.93
V
V
V
A
A
mA
mA
A
W
W /o C
VESD(G-S) Gate-Source ESD (HBM - C= 100pF, R=1.5 kΩ)
2
VESD(G-D) G ate-Drain ESD (HBM - C= 100pF, R=1.5 kΩ)
4
VESD(D-S) Drain-Source ESD (HBM - C= 100pF, R=1.5 kΩ)
4
Ts tg Storage Temperature
-65 to 175
Tj Max. Operating Junction Temperature
(•) Pulse width limited by safe operating area
-40 to 175
( 1) ISD ≤60 A, di/dt ≤ 300 A/µs, VDD ≤ V(BR)DSS, Tj ≤ TJMAX
December 1999
kV
kV
kV
oC
oC
1/8