STLS2F01 Datasheet, PDF (1/48 Pages) STMicroelectronics – Loongson 2F: High performance 64-bit superscalar MIPS® microprocessor

STLS2F01
Loongson 2F:
High performance 64-bit superscalar MIPS^® microprocessor
Preliminary Data
Features
■ 64-bit superscalar architecture
■ 900 MHz clock frequency
■ Single/double precision floating-point units
■ New streaming multimedia instruction set
support (SIMD)
■ 64 Kbyte instruction cache, 64 Kbyte data
cache, on-chip 512 Kbyte unified L2 cache
■ On chip DDR2-667 and PCI-X controller
■ 4 W @ 900 MHz power consumption:
– Best in class for power management
– Voltage/frequency scaling
– Stand-by mode support
– L2 cache disable/enable option
■ Leading edge 90 nm process technology
■ 27x27 heat spreader flip-chip BGA package
■ MIPS based instruction set (MIPS III
compatible)
Description
The STLS2F01 is a MIPS based 64-bit
superscalar microprocessor, able to issue four
instructions per clock cycle among six functional
units: two integer, two single/double-precision
floating-point, one 64bit SIMD and one load/store
unit.
The micro architecture is organized with nine-
stage of pipeline and support of dynamic branch
prediction.
HFCBGA452 (27x27x2.9mm)
The memory hierarchy is composed by the first
level of 64 Kbyte 4-way set associative caches for
instructions and data, the second level of
512 Kbyte unified 4-way set associative cache
and the memory management unit (MMU) with
translation lookaside buffer (TLB).
The Loongson microprocessor family is the
outcome of a successful collaboration started in
2004 between STMicroelectronics and the
Institute of Computing Technology, part of the
Chinese Academy of Science. Loongson
microprocessors were co-developed by
STMicroelectronics and the Institute of
Computing Technology to address all the
applications requiring high level of performance
and low power dissipation.
Compared to the STLS2E02 processor, the
STLS2F01 has an enhanced architecture
providing higher performance, reduced power
consumption, integrated DDR2 memory controller
and PCI-X bus interface.
Table 1. Device summary
Part numbers
STLS2F01
Package
HFCBGA452 (27x27x2.9mm)
Packing
Tray
May 2008
Rev 1
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to
change without notice.
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