ST6G3244ME Datasheet, PDF (1/27 Pages) STMicroelectronics – Level translator for SD, SDIO, mini SD, and micro SD Cards with internal I/O supply and ±15 kV ESD protection

ST6G3244ME
Level translator for SD, SDIO, mini SD, and micro SD Cards
with internal I/O supply and ±15 kV ESD protection
Features
■ Supports 60 MHz clock rate
■ Supports DDR mode for SD Card™
■ Compliant with
– SD Specification Part 1 Physical Layer
Specification 3.00 (SDR12, SDR25,
DDR50)
– SD Specification Part 1 Physical Layer
Specification 2.00
■ Bi-directional with direction control pin
■ Balanced propagation delays: t_PLH ≈ t_PHL
■ LDO power-down support. When the LDO is
powered down, V_CCB is pulled to GND via
the 130 Ω resistor. When V_CCB = 0 V, there is
no additional leakage seen on V_CCA.
■ EMI filtering and signal conditioning
■ Supports both 1.8 V and 2.9 V data translation
on card side
■ Integrated LDO to supply 1.8 V or 2.9 V power
for B-side I/Os (pin-selectable); can be used
also externally
■ Integrated pull-up and pull-down resistors on
B-side
■ Operating voltage range
– V_CCA = 1.62 V to 1.98 V
– V_BAT = 3.0 V to 5.0 V
■ Latch-up performance exceeds 100 mA
(JEDEC Standard 78)
■ ESD protection for card side (B-port, CD and
WP pins)
– ±8 kV contact discharge (IEC61000-4-2)
– ±15 kV air-gap discharge (IEC61000-4-2)
■ ESD protection for host side (A-side)
– ±2 kV HBM (JEDEC 22-A114)
– ±200 V MM (JEDEC 22-A115)
Flip Chip 25
■ Operating temperature range –40 °C to +85 °C
■ Space-saving Flip Chip 25 package
(2 x 2 x 0.605 mm, 0.4 mm bump pitch)
■ RoHS compliant, lead-free soldering capable
Applications
■ Mobile phones, smartphones
■ PDAs
■ Cameras
■ SD Card readers
■ Any device with SD memory card
Table 1. Device summary
Order code
Package
Packing
Package
topmark
Flip Chip 25
2x2x
ST6G3244MEBJR 0.605 mm,
0.4 mm
bump pitch
Tape
and reel
(5000
parts per
reel)
VKH,
VKV
November 2011
Doc ID 022157 Rev 2
1/27
www.st.com
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