SPC563MXX Datasheet, PDF (1/48 Pages) STMicroelectronics – Calibration external bus interface

SPC563Mxx
32-bit Power Architecture^® based on MCU for automotive
powertrain applications
Data brief
Features
■ Single issue, 32-bit Power Architecture^® Book
E compliant e200z335 CPU core complex
– Includes variable length encoding (VLE)
enhancements for code size reduction
LQFP144
20 mm x 20 mm
LQFP176
24 mm x 24 mm
LQFP100
14 mm x 14 mm
LFBGA208
17 mm x 17 mm
x 1.5 mm
■ 32-channel direct memory access controller
(DMA)
■ Interrupt controller (INTC) capable of handling
364 selectable-priority interrupt sources: 191
peripheral interrupt sources, 8 software
interrupts and 165 reserved interrupts.
■ Frequency-modulated phase-locked loop
(FMPLL)
■ Calibration external bus interface (EBI)^(a)
■ System integration unit (SIU)
■ Up to 1.5 Mbyte on-chip Flash with Flash
controller
– Fetch Accelerator for single cycle Flash
access @80 MHz
■ Up to 94 Kbyte on-chip static RAM (including
up to 32 Kbyte standby RAM)
■ Boot assist module (BAM)
■ 32-channel second-generation enhanced time
processor unit (eTPU)
– 32 standard eTPU channels
– Architectural enhancements to improve
code efficiency and added flexibility
■ 16-channels enhanced modular input-output
system (eMIOS)
■ Enhanced queued analog-to-digital converter
(eQADC)
■ Decimation filter (part of eQADC)
■ Silicon die temperature sensor
■ 2 deserial serial peripheral interface (DSPI)
modules (compatible with Microsecond Bus)
■ 2 enhanced serial communication interface
(eSCI) modules compatible with LIN
■ 2 controller area network (FlexCAN) modules
that support CAN 2.0B
■ Nexus port controller (NPC) per IEEE-ISTO
5001-2003 standard
■ IEEE 1149.1 (JTAG) support
■ Nexus interface
■ On-chip voltage regulator controller that
provides 1.2 V and 3.3 V internal supplies from
a 5 V external source.
a. The external bus interface is only accessible when
using the calibration tool. It is not available on
production packages.
■ Designed for LQFP100, LQFP144, LQFP176
and LBGA208 packages.
Table 1. Device summary
Part number
Memory Flash size
Package: LQFP100 Package: LQFP144 Package: LQFP176 Package: LBGA208
1536 Kbyte
-
SPC563M64L5
SPC563M64L7
-
September 2013
Doc ID 13850 Rev 6
For further information contact your local STMicroelectronics sales office.
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