SO14 Datasheet, PDF (1/2 Pages) STMicroelectronics – SO 14

®
Thermal Data
SO 14
14 leads
item #
PACKAGE MATERIAL LIST
material
thickness
leadframe
die attach
molding
compound
copper
epoxy glue
( silver filler )
epoxy resin
0.20 mm
10-40 µm
1.65 mm
thermal
conductivity
2.61 W/cm°C
0.01 W/cm°C
0.0063W/cm°C
Charts enclosed :
1) Rth(j-a) vs power dissipation
2) Zth(j-a) vs time width and die size
February 1998
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