SMARTCARD Datasheet, PDF (1/2 Pages) STMicroelectronics – Ordering Information For Package And Delivery

SMARTCARD MCU
Ordering Information
For Package And Delivery
DATA BRIEFING
INTRODUCTION
The manufacturing process of Smartcards in-
volves various components and technologies in
order to issue a finished product:
– micromodules,
– flat packages,
– wafers.
s MICROMODULES
Dedicated package for Smartcard products, the
micromodule type depends on the size of the
product and on the application.
Table 1 lists all available micromodules.
s FLAT PACKAGES
For applications which require surface mount tech-
nology, suitable for PC cards, or other security
modules, STMicroelectronics offers flat packages
listed In Table 2.
s WAFERS
For issuer production need, ST offers sawn and
unsawn wafers deliveries, listed in Table 3.
Figure 1. Delivery form
SO20
Table 1. Micromodules in super 35 standard
tape
Type
Description
D1, D2
8 contacts for memory cards
D15
6 contacts for memory cards
D3, D4
8 contacts with ring MCU cards
D5
8 contacts for dual contact contactless
MCU cards
D68
8 contacts for MCU cards
D7
6 contacts for dual contact contactless
MCU cards
C7
Full contactless for MCU cards
D8
8 contacts for MCU cards
Table 2. Flat Packages
Type
Description
O20
SO20 for MCU products
QF4
TQFP44 for MCU products
R20
SO20 on tape and reel for MCU products
Micromodule
8” Wafer
261a.ai
Notch
Table 3. Wafers
Type
Description
W00
Unsawn wafers, 750 µm thickness
W20
Unsawn wafers, 275 µm thickness
W40
Unsawn wafers, 180 µm thickness
S2x
280 µm sawn wafers on UV tape
R4x
180 µm sawn wafers on insolated UV tape
S4x
180 µm sawn wafers on UV tape
T4x
180 µm sawn wafers on blue tape
September 2001
1/2
This is Brief Data from STMicroelectronics. Details are subject to change without notice. For complete data, please contact
your nearest Sales Office or SmartCard Products Divison, Rousset, France. Fax: [phone].