PLCC20 Datasheet, PDF (1/2 Pages) STMicroelectronics – PLCC 20

®
Thermal Data
PLCC 20
20 leads
PACKAGE MATERIAL LIST
item #
leadframe
die attach
molding
compound
material
copper
epoxy glue
( silver filler )
epoxy resin
thickness
0.25 mm
10-40 µm
thermal
conductivity
2.61 W/cm°C
0.01 W/cm°C
3.6 mm
0.0063W/cm°C
Charts enclosed :
1) Rth(j-a) vs power dissipation
2) Rth(j-a) vs on board trace area
3) Zth(j-a) vs time width and die size
February 1998
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