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M36D0R6040T0 Datasheet, PDF (1/18 Pages) STMicroelectronics – 64 Mbit (4Mb x16, Multiple Bank, Page) Flash Memory and 16 Mbit (1Mb x16) PSRAM, Multi-Chip Package | |||
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M36D0R6040T0
M36D0R6040B0
64 Mbit (4Mb x16, Multiple Bank, Page) Flash Memory
and 16 Mbit (1Mb x16) PSRAM, Multi-Chip Package
FEATURES SUMMARY
â MULTI-CHIP PACKAGE
â 1 die of 64 Mbit (4Mb x 16) Flash Memory
â 1 die of 16 Mbit (1Mb x 16) Pseudo SRAM
â SUPPLY VOLTAGE
â VDDF = VDDP = 1.7V to 1.95V
â LOW POWER CONSUMPTION
â ELECTRONIC SIGNATURE
â Manufacturer Code: 20h
â Device Code (Top Flash Configuration),
M36D0R6040T0: 8810h
â Device Code (Bottom Flash
Configuration), M36D0R6040B0: 8811h
â PACKAGE
â Compliant with Lead-Free Soldering
Processes
â Lead-Free Versions
FLASH MEMORY
â PROGRAMMING TIME
â 8µs by Word typical for Fast Factory
Program
â Double/Quadruple Word Program option
â Enhanced Factory Program options
â MEMORY BLOCKS
â Multiple Bank Memory Array: 4 Mbit
Banks
â Parameter Blocks (Top location)
â ASYNCHRONOUS READ
â Asynchronous Page Read mode
â Random Access: 70ns
â DUAL OPERATIONS
â Program Erase in one Bank while Read in
others
â No delay between Read and Write
operations
â BLOCK LOCKING
â All blocks locked at Power-up
â Any combination of blocks can be locked
â WPF for Block Lock-Down
Figure 1. Package
FBGA
Stacked TFBGA67 (ZAI)
12 x 8mm
â SECURITY
â 128-bit user programmable OTP cells
â 64-bit unique device number
â COMMON FLASH INTERFACE (CFI)
â 100,000 PROGRAM/ERASE CYCLES per
BLOCK
PSRAM
â ACCESS TIME: 70ns
â LOW STANDBY CURRENT: 110µA
â DEEP POWER DOWN CURRENT: 10µA
December 2004
1/18
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