M14C32DD Datasheet, PDF (1/2 Pages) STMicroelectronics – M14C32 Die Description

M14C32 DD
M14C32 Die Description
PRODUCT
s WAFER SIZE
M14C32
152 mm (6 inches)
s DIE IDENTIFICATION M14C32KA_R
s DIE SIZE (X x Y)
2040 x 2355 µm
s SCRIBE LINE
100.5 x 101.7 µm
s PAD OPENING
100 x 100 µm
DIE LAYOUT
s DI
Die Identification (at the position shown in Figure 1)
s C1, C2, C3, C5, C7 Pad contacts to the ISO pins (at the positions shown in Figure 1)
s C4, C6, C8
These ISO pins do not appear on the M14C32 die
s NC
This pad, shown in Figure 1, is Not Connected
Pad locations are measured relative to the die centre (where X and Y are respectively the horizontal and
vertical axis, measured in µm).
Figure 1. M14C32 Die Plot
C7: SDA (X= –649.92; Y= +993.44)
C5: GND (X= +718.0; Y= +1010.0)
NC: TEST
DI
NC: TEST
C3: SCL
(X= –837.28; Y= –904.24)
C2: WC (X= –648.48; Y= –993.6)
DD.M14C32/9811V1.1
AI02495
NC: TEST
C1: VCC (X= +650.08; Y= –993.76)
1/2