M14C16DD Datasheet, PDF (1/2 Pages) STMicroelectronics – M14C16 Die Description

M14C16 DD
M14C16 Die Description
PRODUCT
s WAFER SIZE
M14C16
152 mm (6 inches)
s DIE IDENTIFICATION M14C16KA_R
s DIE SIZE (X x Y)
1390 x 2375 µm
s SCRIBE LINE
101.8 x 102.4 µm
s PAD OPENING
100 x 100 µm
DIE LAYOUT
s DI
Die Identification (at the position shown in Figure 1)
s C1, C2, C3, C5, C7 Pad contacts to the ISO pins (at the positions shown in Figure 1)
s C4, C6, C8
These ISO pins do not appear on the M14C16 die
s NC
This pad, shown in Figure 1, is Not Connected
Pad locations are measured relative to the die centre (where X and Y are respectively the horizontal and
vertical axis, measured in µm).
Figure 1. M14C16 Die Plot
C7: SDA (X= –429.0; Y= +1004.3)
NC: TEST
C5: GND (X= +337.7; Y= +1020.6)
DI
NC: TEST
C3: SCL (X= –514.4; Y= –904.4)
AI02496
C2: WC (X= –349.4; Y= –1004.4)
DD.M14C16/9811V1.1
NC: TEST
C1: VCC (X= +514.3; Y= –604.0)
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