HSP061-2 Datasheet, PDF (1/12 Pages) STMicroelectronics – 2-line ESD protection for high speed lines

HSP061-2
2-line ESD protection for high speed lines
Features
■ Flow-through routing to keep signal integrity
■ Ultralarge bandwidth: 6 GHz
■ Ultralow capacitance: 0.6 pF
■ Low leakage current: 100 nA at 25 °C
■ Extended operating junction temperature
range: -40 °C to 150 °C
■ RoHS compliant
Benefits
■ High ESD robustness of the equipment
■ Suitable for high density boards
Complies with following standards
■ MIL-STD 883G Method 3015-7 Class 3B:
– 8 kV
■ IEC 61000-4-2 level 4:
– 15 kV (air discharge)
– 8 kV (contact discharge)
Applications
The HSP061-2 series is designed to protect
against electrostatic discharge on sub micron
technology circuits driving:
■ HDMI 1.3 and 1.4
■ Digital Video Interface
■ Display Port
■ USB 3.0
■ Serial ATA
■ Ethernet
■ HMI
HSP061-2M6
µQFN-6L
HSP061-2N4
µQFN-4L
HSP061-2P6
SOT-666
Figure 1. Functional schematic (top view)
I/O1 1
6 I/O1 ^{I/O1 1}
6 I/O1
GND 2
5 VBUS GND 2
5 VBUS
I/O2 3
4 I/O2 I/O2 ³
4 I/O2
µQFN 6 leads
SOT666
I/O1 ^GND I/O2
NC
NC
µQFN 4 leads
Description
The HSP061-2 is a 2-channel ESD array with a
rail to rail architecture designed specifically for the
protection of high speed differential lines.
The ultralow variation of the capacitance ensures
very low influence on signal-skew. The large
bandwidth makes it compatible with 5 Gbps.
The HSP061-2P6 is housed in SOT-666. The
HSP061-2M6 is packaged in µQFN-6L (1.45 x
1.0 mm) with a 500 µm pitch. The HSP061-2N4 is
packaged in µQFN-4L (1.0 x 0.8 mm) with a
400 µm pitch.
February 2012
Doc ID 022777 Rev 1
1/12
www.st.com
12