EMIF06-HSD03F3 Datasheet, PDF (1/10 Pages) STMicroelectronics – EMI filter with integrated ESD protection for micro-SD Card™

EMIF06-HSD03F3
EMI filter with integrated ESD protection for micro-SD Card™
Flip-Chip package
(17 bumps)
Figure 1. Pin configuration (bump side)
,
2
9FF
,
2
*1'
,
2
*1'
,
2
*1'
,
2
'(7
,
2
Figure 2. Functional schematic
L = 1 nH R = 1 Ω
Ix
Ox
CLINE = 2.5 pF
DET
VCC
Datasheet  production data
Features
 Very low line capacitance to compensate long
PCB tracks (2.5 pF typ.)
 High efficiency in ESD suppression up to 18 kV
(IEC 61000-4-2)
 Very low PCB space consumption:
– 1.1 x 2.4 mm
 Ultralow leakage current: 20 nA max.
 Very thin package: 0.605 mm
 Smart pinout for easier PCB layout
 High reduction of parasitic elements through
integration and wafer level packaging
 Lead-free package
 Complies with the following standards:
– IEC 61000-4-2 level 4:±15 kV (air
discharge), ±8 kV (contact discharge)
Application
 SD3.0, UHS-1 SDR104 (208 MHz)
Description
The EMIF06-HSD03F3 chip is a highly integrated
device designed to suppress EMI/RFI noise for
interface line filtering.
The EMIF06-HSD03F3 Flip-Chip packaging
means the package size is equal to the die size.
That’s why EMIF06-HSD03F3 is a very small
device. Additionally, this filter includes ESD
protection circuitry, which prevents damage to the
protected device when subjected to ESD surges
up 18 kV.
October 2016
This is information on a product in full production.
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