EMIF06-AUD01F2 Datasheet, PDF (1/14 Pages) STMicroelectronics – 6-line EMI filter and ESD protection for audio interface

EMIF06-AUD01F2
6-line EMI filter and ESD protection for audio interface
Features
■ 4-line EMI filter and ESD protection for internal
and external (headset) microphone
■ 2-line EMI filter and ESD protection for headset
speaker
Benefits
■ EMI (I/O) low-pass filter
■ High efficiency EMI filter
■ Very low PCB space consumption: 4.6 mm²
■ Very thin package: 0.65 mm
■ High efficiency in ESD suppression
■ High reliability offered by monolithic integration
■ High reduction of parasitic elements through
integration and wafer level packaging
Complies with following standards
■ IEC 61000-4-2 level 4 external pins
– 15 kV (air discharge)
– 8 kV (contact discharge)
■ IEC 61000-4-2 level 1 internal pins
– 2 kV (air discharge)
– 2 kV (contact discharge)
Applications
ESD protection and EMI/RFI filtering for the audio
bottom connector interface, where EMI filtering in
ESD sensitive equipment is required:
■ Mobile phones and communication systems
■ Wireless modules
Flip chip package, 20 bumps
Description
The EMIF06-AUD01F2 is a highly integrated
device designed to suppress EMI/RFI noise in all
systems subjected to electromagnetic
interference. The flip chip packaging means the
package size is equal to the die size.
This filter includes ESD protection circuitry, which
prevents damage to the application when it is
subjected to ESD surges up to 15 kV.
Figure 1. Pin configuration
1
2
3
4
5
A
MIC1P
MIC2N
MIC2P
SPK_R
SPK_L
B
MIC1N
BIAS1
GND
Int
HOOK
GND
C
GND
MIC1P
int
MIC2N
int
BIAS2
SPK_L
int
D
MIC1N
int
BIAS3
MIC2P
int
SPK_R
int
PHG
Silicon side
February 2008
Rev 1
1/14
www.st.com