EMIF06-1002F2 Datasheet, PDF (1/7 Pages) STMicroelectronics – 6-line IPAD™, EMI filter and ESD protection

EMIF06-1002F2
6-line IPAD™, EMI filter and ESD protection
Features
■ Lead-free package
■ Very low PCB space consumption
1.92 mm x 1.79 mm
■ Very thin package: 0.65 mm
■ High efficiency in ESD suppression
(IEC 61000-4-2 level 4 on external pins)
■ High reliability offered by monolithic integration
■ High reduction of parasitic elements through
integration and wafer level packaging
Complies with the following standards
■ IEC 61000-4-2 level 4:
– 15 kV (air discharge)
– 8 kV (contact discharge)
Application
This device is designed for EMI filtering in ESD
sensitive equipment such as mobile phones.
Description
The EMIF06-1002F2 is a highly integrated device
designed to suppress EMI/RFI noise in all
systems subjected to electromagnetic
interference. The EMIF06-1002F2 Flip Chip
packaging means the package size is equal to the
die size.
This filter includes an ESD protection circuitry
which prevents damage to the application when
subjected to ESD surges up 15 kV. This device
includes 6 EMI filters.
Flip Chip
(14 bumps)
Figure 1. Pin configuration (bump side)
4
3
2
1
I2
O2 A
I1 O1
B
I3
O3 C
GND GND
D
I4
O4 _E
I6 O6
F
I5
O5 _G
Figure 2. Basic cell configuration
External pin
Internal pin
TM: IPAD is a trademark of STMicroelectronics.
March 2010
Doc ID 14730 Rev 2
1/7
www.st.com
7