EMIF03SIM02F2 Datasheet, PDF (1/8 Pages) STMicroelectronics – 3-line IPAD™, EMI filter including ESD protection

EMIF03-SIM02F2
3-line IPAD™, EMI filter including ESD protection
Features
■ EMI symmetrical (I/O) low-pass filter
■ High efficiency in EMI filtering
■ Lead-free package
■ Very low PCB space consuming:
1.42 mm x 1.42 mm
■ Very thin package: 0.65 mm
■ High efficiency in ESD suppression
■ High reliability offered by monolithic integration
■ High reduction of parasitic elements through
integration and wafer level packaging
Complies with the following standards
■ IEC 61000-4-2, Level 4 on external and V_cc
pins:
– 15 kV (air discharge)
– 8 kV (contact discharge)
■ IEC 61000-4-2, Level 1 on internal pins:
– 2 kV (air discharge)
– 2 kV (contact discharge)
■ MIL STD 883E - Method 3015-6 Class 3
Applications
EMI filtering and ESD protection for:
■ SIM Interface (Subscriber Identify Module)
■ UIM Interface (Universal Identify Module)
Flip Chip
(8 bumps)
Figure 1. Pin configuration (bump side)
321
RST RST
in
ext
A
CLK
in
Gnd
CLK
ext
B
Data
in
VCC
Data
ext
C
Figure 2. Configuration
VCC
RST in
CLK in
Data in
100 Ω
R1
47 Ω
R2
100 Ω
R3
GND
RST ext
CLK ext
Data ext
Cline = 20pF max.
Description
The EMIF03-SIM02F2 is a highly integrated
device designed to suppress EMI/RFI noise in all
systems subjected to electromagnetic
interference.The EMIF03 Flip Chip packaging
means the package size is equal to the die size.
This filter includes an ESD protection circuitry
which prevents damage to the application when
subjected to ESD surges up 15kV.
TM: IPAD is a trademark of STMicroelectronics.
April 2008
Rev 6
1/8
www.st.com
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