EMIF03-SIM02C2 Datasheet, PDF (1/8 Pages) STMicroelectronics – 3 line EMI filter including ESD protection

IPAD™
EMIF03-SIM02C2
3 line EMI filter including ESD protection
Main product characteristics
Where EMI filtering in ESD sensitive equipment is
required:
■ SIM Interface (Subscriber Identify Module)
■ UIM Interface (Universal Identify Module)
Description
The EMIF03-SIM02C2 is a highly integrated
device designed to suppress EMI/RFI noise in all
systems subjected to electromagnetic
interference. The EMIF03 Flip-Chip packaging
means the package size is equal to the die size.
This filter includes an ESD protection circuitry
which prevents the device from destruction when
subjected to ESD surges up 15kV.
Benefits
■ EMI symmetrical (I/O) low-pass filter
■ High efficiency in EMI filtering
■ Lead free coated package
■ Very low PCB space consuming:
– 1.42mm x 1.42mm
■ Very thin package: 0.65 mm
■ High efficiency in ESD suppression
■ High reliability offered by monolithic integration
■ High reducing of parasitic elements through
integration and wafer level packaging
Coated Flip-Chip package
(8 bumps)
Pin configuration (Bump side)
321
RST RST
in
ext
A
CLK
in
Gnd
CLK
ext
B
Data
in
VCC
Data
ext
C
Complies with following standards:
IEC 61000-4-2
Level 4 on external and V_CC pins:
15 kV (air discharge)
8 kV (contact discharge
Level 1 on internal pins:
2 kV (air discharge)
2 kV (contact discharge
MIL STD 883G - Method 3015-7 Class 3
March 2007
Rev 2
1/8
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