EMIF03-SIM01F2_08 Datasheet, PDF (1/7 Pages) STMicroelectronics – 3-line IPAD™, EMI filter including ESD protection

EMIF03-SIM01F2
3-line IPAD™, EMI filter including ESD protection
Features
■ EMI symmetrical (I/O) low-pass filter
■ High efficiency in EMI filtering
■ Lead-free package
■ Very low PCB space occupation:
1.42 mm x 1.42 mm
■ Very thin package: 0.65 mm
■ High efficiency in ESD suppression
■ High reliability offered by monolithic integration
■ High reduction of parasitic elements through
integration and wafer level packaging
Complies with the following standards
■ IEC 61000-4-2 level 4 on input pins
– 15 kV (air discharge)
– 8 kV (contact discharge)
■ MIL SRD 883E - Method 3015-6 Class 3
Applications
EMI filtering and ESD protection for:
■ SIM interface (subscriber identity module)
■ UIM interface (universal identity module)
Description
The EMIF03-SIM01F2 is a highly integrated
device designed to suppress EMI/RFI noise in all
systems subjected to electromagnetic
interference. The EMIF03 Flip Chip packaging
means the package size is equal to the die size.
This filter includes ESD protection circuitry which
prevents damage to the application when
subjected to ESD surges up 15 kV.
Flip Chip
(8 bumps)
Figure 1. Pin layout (bump side)
321
RST RST
in
out
A
CLT
in
Gnd
CLT
out
B
Data
in
VCC
Data
out
C
Figure 2. Configuration
VCC
RST in
CLK in
Data in
100 Ω
R1
47 Ω
R2
100 Ω
R3
GND
RST out
CLK out
Data out
Cline = 35pF max.
April 2008
TM: IPAD is a trademark of STMicroelectronics.
Rev 3
1/7
www.st.com
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