EMIF02-MIC03C2 Datasheet, PDF (1/7 Pages) STMicroelectronics – 2 line EMI filter and ESD protection

EMIF02-MIC03C2
2 line EMI filter and ESD protection
Main product characteristics
Where EMI filtering in ESD sensitive equipment is
required:
■ Mobile phones and communication systems
■ Computers and printers and MCU Boards
Description
The EMIF02-MIC03C2 is a highly integrated
device designed to suppress EMI/RFI noise in all
systems subjected to electromagnetic
interference. The Flip-Chip packaging means the
package size is equal to the die size.
This filter includes ESD protection circuitry, which
prevents damage to the application when it is
subjected to ESD surges up to 15 kV.
Benefits
■ EMI symmetrical (I/O) low-pass filter
■ High efficiency EMI filter (-35 dB @ 900 MHz)
■ Very low PCB space consumption:
1.07 mm x 1.47 mm
■ Very thin package: 0.695 mm
■ Coating resin on back side and lead free
package
■ High efficiency in ESD suppression
■ High reliability offered by monolithic integration
■ High reduction of parasitic elements through
integration and wafer level packaging.
Coated Flip-Chip package
(about 20 times real size)
Pin configuration (Bump side)
321
I2
I1
A
GND
B
O2 O1 C
Complies with following standards:
IEC 61000-4-2
level 4 input pins
level 1 output pins
15 kV
8 kV
2 kV
2 kV
(air discharge)
(contact discharge
(air discharge)
(contact discharge
MIL STD 883G - Method 3015-7 Class 3
November 2006
Rev 1
1/7
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