DIP2450-01D3 Datasheet, PDF (1/10 Pages) STMicroelectronics – 2 G / 5 G WLAN diplexer

DIP2450-01D3
2 G / 5 G WLAN diplexer
Features
■ Low insertion loss in pass band
■ High attenuation levels
■ High rejection of out-of-band frequencies
■ Small footprint: <1.4 mm²
Benefits
■ Very low profile (<600 µm after reflow)
■ High Q, low loss
■ High RF performance
■ Tight tolerance
■ Bill of materials and area reduction
Applications
■ WLAN
■ Bluetooth
■ Mobile phone application
■ Wireless networking
Description
This diplexer targets the use of dual band 2.4 GHz
and 5 GHz. The DIP2450-01D3 is a diplexer
dedicated to the WLAN/BT application.
It is designed using STMicroelectronics IPD
(integrated passive device) technology on non
conductive glass substrate to optimize RF
performance.
Datasheet − production data
Flip Chip package 4 bumps
Figure 1. Pin configuration (bump view)
1
2
5G
2G A
ANT
GND ^B
June 2012
This is information on a product in full production.
Doc ID 023193 Rev 1
1/10
www.st.com
10