DIP20 Datasheet, PDF (1/2 Pages) STMicroelectronics – Thermal Data

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Thermal Data
DIP 20
20 leads
PACKAGE MATERIAL LIST
item #
leadframe
die attach
molding
compound
material
copper
epoxy glue
( silver glue )
epoxy resin
thickness
0.25 mm
10-40 µm
thermal
conductivity
2.61 W/cm°C
0.01 W/cm°C
3 mm
0.0063W/cm°C
Typical assembly configuration before molding :
Charts enclosed :
1) Rth(j-a) vs power dissipation
2) Zth(j-a) vs time width and die size
February 1998
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