AN4211 Datasheet, PDF (1/13 Pages) STMicroelectronics – Guidelines for soldering MEMS microphones

AN4211
Application note
Guidelines for soldering MEMS microphones
By Alessandro Morcelli
Introduction
This application note provides guidelines and recommendations for soldering MEMS
microphones on application boards. Microphones, as pressure sensors, sense the
mechanical stress coming from the PCB, hence this force should be kept to a minimum.
Printing and stencil parameters, followed by device footprints, recommended land and
stencil patterns, and process considerations are presented in this document.
The following guidelines have been developed for the MEMS microphone family
(MP45DT02, MP34DB01, MP34DT01, MP33AB01, and MP33AB01H) offered by
STMicroelectronics.
Demonstration boards (STEVAL-MKI129Vx) for the evaluation and promotion of the
MP45DT02, MP34DT01, and MP34DT01 are also available. Please refer to AN4184
"Microphone coupon boards STEVAL-MKI129Vx based on the MP45DT02, MP34DB01,
and MP34DT01" on www.st.com for further information.
Figure 1. Mechanical specifications for soldering
August 2014
DocID023971 Rev 3
1/13
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