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AN4075 Datasheet, PDF (1/23 Pages) STMicroelectronics – STEVAL-IFP016V2 IO-Link communication master transceiver
AN4075
Application note
STEVAL-IFP016V2 IO-Link communication master transceiver
demonstration board
By Gaetano Rinaldi
Introduction
The STEVAL-IFP016V2 demonstration board works as an IO-Link communication master
transceiver. In combination with the STEVAL-PCC009V2 or STEVAL-PCC009V1
demonstration board, the application can evaluate all the features of the L6360 IC.
The L6360 is a monolithic IO-Link master port, compliant with PHY2 (3 wires) supporting
COM1 (4.8 kbaud), COM2 (38.4 kbaud) and COM3 (230.4 kbaud) modes.
The C/QO output stage (high-side, low-side or push-pull) as well as the cutoff current, cutoff
current delay time, and restart delay are programmable.
The cutoff current and cutoff current delay time, combined with the thermal shutdown and
automatic restart, protect the device against overload and short-circuit.
The C/QO and L+ output stages are able to drive resistive, inductive and capacitive loads.
Fast demagnetization on the L+ switch is able to dissipate the energy stored in the inductive
loads.
The supply voltage is monitored and low-voltage conditions are detected.
The L6360 transfers, through PHY2 (C/QO pin), data received from a host microcontroller to
USART (INC/QO pin), or transfers data received from PHY2 (C/QI pin) to USART (OUTC/QI
pin). For more details on the complete system please refer to the application schematic.
To enable full IC control, configuration and monitoring (i.e. fault conditions stored in the
status register), the communication between the system microcontroller and the L6360 is
based on a fast mode, 2-wire I2C bus.
The L6360 has 9 registers to manage the programmable parameters and the status of the
IC.
Monitored fault conditions include L+ line, overtemperature, C/Q overload, linear regulator
undervoltage, and parity check.
Internal LED driver circuitries, in open-drain configuration, provide two programmable
sequences to drive two LEDs.
A large GND area on the printed circuit board has been designed in order to minimize noise
and ensure good thermal performance.
April 2012
Doc ID 022954 Rev 1
1/23
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