AN3232 Datasheet, PDF (1/26 Pages) STMicroelectronics – Mounting recommendations

AN3232
Application note
Mounting recommendations
for STAC^® boltdown packages
Introduction
RF power transistors are amongst the highest power density devices in the semiconductor
industry. It is crucial to the reliability and performance of such devices to consider
mechanical stress and thermal and electrical resistance within the application environment.
The general purpose of this application note is to provide guidelines for mounting various
types of STAC^® packages in amplifiers or application boards (PCB) by means of bolting or
by soldering. Specific attention is paid to the STAC244B and STAC265B boltdown styles and
the STAC244F and STAC265F flangeless styles, which are used to encapsulate numerous
VDMOS and LDMOS technology products.
This application note is intended to provide mounting tips and design guidelines. For actual
data please refer to the relevant product datasheet.
STAC is a registered trademarks of STMicroelectronics.
Figure 1. STAC boltdown packages
August 2011
Doc ID 17594 Rev 3
1/26
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