AN2639 Datasheet, PDF (1/15 Pages) STMicroelectronics – Soldering recommendations and package information for Lead-free ECOPACK microcontrollers

AN2639
Application note
Soldering recommendations and package information for Lead-free
ECOPACK microcontrollers
Introduction
STMicroelectronics microcontrollers support various types of Lead-free ECOPACK^®
package to meet customer requirements.
The mounting technologies are Surface mount technology (SMT), and Through hole
technology (THT). Beside the available mounting technology, the choice is often driven by
technical and economical concerns. This application note describes the various package
types used for microcontrollers, introduces the different mounting technologies, and gives
soldering recommendations.
July 2014
DocID14016 Rev 4
1/15
www.st.com