A22H165M Datasheet, PDF (1/32 Pages) STMicroelectronics – Integrated high-efficiency buck converter

A22H165M
High-performance class-G stereo headphone amplifier with I²C
volume control
Datasheet - production data
A22H165M - Flip-chip
Applications
• Cellular /smart phones, portable media players
• Wearable
• Fitness and healthcare
Pinout (top view)
Description
INR-
VOUTR
SCL
SDA D
INR+
CMS
PVSS
C2
C
INL+
HPVDD
C1
AGND B
INL-
VOUTL
AVDD
SW
A
4
3
2
1
Balls are underneath
Features
• Power supply range: 2.3 V to 4.8 V
• 0.6 mA/channel quiescent current
• 2.1 mA current consumption with
100 µW/channel (10 dB crest factor)
• 0.006% typical THD+N at 1 kHz
• 100 dB typical PSRR at 217 Hz
• 100 dB of SNR A-weighted at G = 0 dB
• Zero pop and click
• I²C interface for volume control
• Digital volume control range from -60 dB to
+4 dB
• Independent right and left channel shutdown
control
• Integrated high-efficiency buck converter
• Low software standby current: 5 µA max
• Output coupling capacitors removed
• Thermal shutdown and short-circuit protection
• Flip-chip package: 1.65 mm x 1.65 mm,
400 µm pitch, 16 bumps
The A22H165M is a class-G stereo headphone
driver dedicated to high audio performance, high
power efficiency and space-constrained
applications such as wearable and fitness.
It is based on the core technology of a low power
dissipation amplifier combined with a high
efficiency buck converter for supplying this
amplifier.
When powered by a battery, the buck converter
generates the appropriate voltage to the amplifier
depending on the amplitude of the audio signal to
supply the headsets. It achieves a total 2.1 mA
current consumption at 100 µW output power (10
dB crest factor).
THD+N is 0.02% maximum at 1 kHz and PSRR is
100 dB at 217 Hz, which ensures a high audio
quality of the device in a wide range of
environments.
The traditionally bulky output coupling capacitors
can be removed.
A dedicated common-mode sense pin removes
parasitic ground noise.
The A22H165M is designed to be used with an
output serial resistor. It ensures unconditional
stability over a wide range of capacitive loads.
The A22H165M is packaged in a tiny 16-bump
flip-chip package with a pitch of 400 µm.
March 2014
This is information on a product in full production.
DocID026035 Rev 1
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