QFP-SD Datasheet, PDF (2/2 Pages) STATS ChipPAC, Ltd. – Stacked Die Quad Flat Pack

QFP-SD
Stacked Die Quad Flat Pack
SPECIFICATIONS
Die Thickness
100-600µm (4-24mils)
Package Body Thickness 1.0, 1.4mm
Marking
Laser/ink
Packing Options
JEDEC tray/tape and reel
ELECTRICAL PERFORMANCE
Package
(mm)
Pad Size Lead/Wire
(mm)
(mm)
7 x 7 (32L) 138 x 138
14 x 14 (128L) 275 x 275
1.4-2.2
2
3.0-4.5
2
Note: Results are simulated values at 100MHz.
Resistance
(mOhm)
11.0-18.0
120
24.0-36.0
120
RELIABILITY
Moisture Sensitivity Level
Temperature Cycling
High Temperature Storage
Pressure Cooker Test
Temperature/Humidity Test
JEDEC Level 3, 260°C reflow
Condition C (-65°C to 150°C)
1000 cycles
150°C, 1000 hrs
121°C/100% RH/2 atm, 168 hrs
85°C/85% RH, 1000 hrs
Inductance
Self (nH)
Mutual (nH)
0.64-0.99
1.65
1.96-2.92
1.65
0.31-0.49
0.45-0.85
1.08-1.61
0.45-0.85
Capacitance
Self (pF)
Mutual (pF)
0.21-0.33
0.1
0.69-1.03
0.1
0.07-0.12
0.01-0.02
0.31-0.45
0.01-0.02
THERMAL PERFORMANCE
The thermal performance of each die in the stack is influenced by other die in the stack. Thermal performance is highly dependent on
package size, die size, substrate layers and thickness, and lead configuration. Simulation for specific applications should be performed.
CROSS-SECTION
LQFP-SD
LQFP-ep-SD
PACKAGE CONFIGURATIONS
Package Size
LQFP-SD
LQFP-ep-SD
TQFP-ep-SD
Body Size (mm)
7 x 7 to 28 x 28
10 x 10 to 24 x 24
7 x 7 to 14 x 14
Lead Count
32 to 208
64 to 216
32 to 100
TQFP-ep-SD
Corporate Office 10 Ang Mo Kio St. 65, #05-17/20 Techpoint, Singapore 569059 Tel: [phone] Fax: [phone]
Global Offices USA 510-979-8000
JAPAN 81-3-5789-5850 CHINA 86-21-5976-5858 MALAYSIA 603-4257-6222
KOREA 82-31-639-8911 TAIWAN 886-3-593-6565 UK 44-1483-413-700
NETHERLANDS 31-38-333-2023
The STATS ChipPAC logo is a registered trademark of STATS ChipPAC Ltd. All other product names and other company names herein are for identification purposes only and may be the trademarks or registered trademarks
of their respective owners. STATS ChipPAC disclaims any and all rights in those marks. STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given, or that the use of such information
will not infringe on intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of, or inability to use the materials in this document.
STATS ChipPAC reserves the right to change the information at any time and without notice.
©Copyright 2006. STATS ChipPAC Ltd. All rights reserved.
May 2006