TQFP Datasheet, PDF (1/2 Pages) STATS ChipPAC, Ltd. – Thin Profile Quad Flat Pack

TQFP
Thin Profile Quad Flat Pack
• 7 x 7mm to 14 x 14mm
• 32 to 128 lead count
• Lead pitch range from 0.80mm
to 0.40mm
FEATURES
• Body Sizes: 7 x 7mm to 14 x 14mm
• Package Height: 1.0mm
• Lead Counts: 32L to 128L
• Lead pitch: 0.80mm to 0.40mm
• Wide range of open tool leadframe and die pad
sizes available
• JEDEC standard compliant
• Lead-free and Green material sets available
DESCRIPTION
The Thin Profile Quad Flat Pack (TQFP) belongs to STATS
ChipPAC’s QFP family. At 1.0mm body thickness, the TQFP
is the thinnest package in the QFP family. This thin package
is made possible by a well controlled low loop wire bonding
process and package warpage control during the molding
process. TQFP is suitable for mainstream cost sensitive
applications where thickness and weight are premium.
APPLICATIONS
• ASIC
• DSP
• Gate Array
• Logic/Microprocessors/Controllers
• Multimedia, PC Chipsets
www.statschippac.com