MQFP-ED Datasheet, PDF (1/2 Pages) STATS ChipPAC, Ltd. – Exposed Drop-in Heat Slug Metric Quad Flat Pack

MQFP-ed
Exposed Drop-in Heat Slug Metric Quad Flat Pack
• 14 x 20mm to 32 x 32mm
• 100 to 240 lead count
• Lead pitch range from 0.80mm
to 0.50mm
FEATURES
• Body Sizes: 14 x 20mm to 32 x 32mm
• Package Height: 3.4mm
• Lead Counts: 100L to 240L
• Lead Pitch: 0.80mm to 0.50mm
• JEDEC standard compliant
• Lead-free and Green material sets available
APPLICATIONS
• ASIC
• DSP
• FPGA
• PLD
• Logic, microprocessors / controllers
• High speed logic, high power microprocessors
• 3D graphics, telecom, wireless, audio, CPU / GUI
DESCRIPTION
STATS ChipPAC’s Exposed Drop-In Heat Slug Metric Quad
Flat Pack (MQFP-ed) is a thermally enhanced version of
the QFP package. Thermal enhancement is achieved by
adding a drop-in exposed anodized aluminum heat spreader
during the molding process, using a standard leadframe.
MQFP-ed typically has 60% higher thermal performance
over the standard MQFP and the QFP-d for higher power
applications.
www.statschippac.com